Selecting device-layer films requires balancing phase stability, resistivity, diffusion behavior, adhesion, thermal budget, morphology, and layer-stack compatibility before integration runs.
Building thin-film libraries across candidate compositions and process conditions, then mapping composition, XRD phase, electrical response, morphology, and scoped characterization outputs.
PVD co-sputtering; reactive sputtering; XRD; electrical mapping; morphology review; uniform test layers for stack-relevant follow-up.
Plausible film regions are identified before device builds or integration experiments. Materials that fail basic film-level constraints are removed earlier.